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High-Efficiency PFPE Fluids for Data Center Single-Phase Immersion Cooling
PFPE & Fluorochemicals
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High-Efficiency PFPE Fluids for Data Center Single-Phase Immersion Cooling

Achieve PUE 1.0 with ChipChill® single-phase immersion cooling fluid for high-density AI data centers. This non-flammable PFPE coolant offers 3,000x higher heat transfer efficiency than air, enabling 30%-50% energy savings. Engineered for long-term stability, it supports carbon neutrality by maximizing server density and reducing cooling noise in any climate.

Key Technical Advantages:

  • Ultimate Efficiency:Heat dissipation efficiency is 3,000 times higher than air cooling.
  • Massive Energy Saving:Reduces data center energy consumption by 30% - 50%.
  • High Density Deployment:Enables ultra-high density server racks for AI & 5G infrastructure.
  • Operational Stability:Supports long-term stable operation with significantly reduced maintenance costs.
  • Eco-Friendly:Directly contributes to Carbon Neutrality and ultra-low PUE goals.

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    Overview

    ChipChill® PFPE Single-Phase Immersion Cooling Fluid: The Ultimate Solution for Ultra-Low PUE Data Centers

    Breakthrough Thermal Management for AI Infrastructure

    ChipChill® PFPE immersion cooling fluid is a revolutionary single-phase thermal management solution designed to achieve a PUE of 1.0 in high-density data centers and 5G infrastructure. By utilizing a fully fluorinated, hydrogen-free molecular structure, ChipChill® delivers a staggering 3,000 times higher heat transfer efficiency than traditional air-cooling methods. This advanced PFPE immersion cooling fluid allows for seamless, direct-contact cooling of high-power GPUs and CPUs, eliminating the need for energy-hungry fans and complex CRAC units. As AI workloads push server densities to the limit, ChipChill® provides the essential non-flammable and high-dielectric protection required to reduce energy consumption by 30% to 50%, paving the way for sustainable, carbon-neutral computing environments.

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    KINGRANDE CHIPCHILL PFPE RC200
    KINGRANDE CHIPCHILL PFPE FLUID RC200

    Superior Material Science & Engineering

    The performance of ChipChill® RC series is rooted in its perfluoropolyether (PFPE) chemistry. Composed exclusively of Carbon, Fluorine, and Oxygen, this fluid is inherently chemically inert and non-corrosive.

     

     

    • Dielectric Integrity: With a dielectric strength exceeding 25kV, it acts as a perfect insulator, preventing any electrical leakage or signal interference, even in the most sensitive high-frequency 5G components.
    • Hardware Longevity: Unlike mineral oils or earlier synthetics, ChipChill® is compatible with almost all rubbers, plastics, and metals (copper, aluminum, gold). It prevents the "swelling" of seals and ensures long-term stable operation of server hardware for years without fluid degradation.

    Strategic AdvantagesSolutions

    ChipChill® immersion cooling transforms data center economics through a multi-dimensional approach:

    • 01

      Extreme Efficiency Solution

      It effectively manages "hot spots" in high-performance computing (HPC), allowing servers to run at peak performance without thermal throttling.

    • 02

      Global Climate Adaptability

      Traditional air cooling depends heavily on ambient temperature. ChipChill® single-phase liquid cooling enables ultra-low PUE in any climatic region, from tropical zones to high-humidity coastal areas.

    • 03

      Noise Reduction & Space Optimization

      By removing fans, it creates a low-noise data center environment and allows for a 3x increase in server rack density, significantly reducing the physical footprint of the facility.

    • 04

      Low Maintenance (OPEX) Reduction

      The fluid’s stability means no frequent oil changes and less mechanical wear on the cooling system, drastically lowering operational costs.

    Applications: From AI Clouds to 5G Edge

    1. AI & GPU Clouds: Providing the thermal overhead needed for the latest NVIDIA and AMD high-TDP accelerators.

    2. 5G Telecommunications: Cooling edge computing stations where space is limited and reliability is paramount.

    3. Blockchain & ASIC Mining: Maximizing hash rates through stable, uniform temperature control.

    4. Sustainable Enterprise Centers: Helping corporations meet their Carbon Neutrality and ESG mandates by cutting power waste.
    KINGRANDE CHIPCHILL PFPE FLUIDS RC200

    Specifications

    Typical Properties of ChipChill® PFPE Fluids

    Grades

    RC130

    RC210

    RC250

    Boiling Point,℃

    130

    210

    250

    Pour Point,℃

    <-100

    -80

    -73

    Density @25℃

    1.76

    1.82

    1.83

    Kinematic Viscosity, cst

    @25℃

    @40℃

    1.10

    0.90

    3.20

    2.30

    8.25

    5.30

    Vapor pressure, Pa @25℃

    1000

    <100

    <100

    Dielectric Constant @25℃ (1kHz)

    1.96

    2.05

    2.05

    Average Molecular Weight

    830

    1410

    1510

    Basic properties of all ChipChill® PFPE Fluids

    Properties

    Units

    Values

    Specific Heat @25℃

    Cal/(g℃)

    0.23

    Thermal Conductivity @25℃

    W/m.℃

    0.07

    Dielectric Strength @25℃

    kV (2.54mm gap)

    >25

    Dielectric Loss tanδ @25℃

     

    <0.1

    Solubility of Water

    ppm (wt)

    15

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