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Non-flammable Dielectric PFPE Fluids with Extreme Thermal-Oxidative Stability
PFPE & Fluorochemicals

Non-flammable Dielectric PFPE Fluids with Extreme Thermal-Oxidative Stability

ChipChill® PFPE Heat Transfer Fluids are high-dielectric PFPE heat transfer fluid for semiconductor etching and precise temperature control. ChipChill® RC series is a non-flammable, hydrogen-free fluid engineered to operate from -100°C to over 300°C. It provides superior thermal stability and chemical inertness for PVD, CVD, and immersion cooling systems where reliability is critical.

    The Ultimate Dielectric Coolant

    ChipChill® RC PFPE Fluids: High-Precision Thermal Management for Semiconductor and Electronic Cooling

    ChipChill® RC is a premium, hydrogen-free PFPE heat transfer fluid engineered for precise temperature control and exceptional dielectric insulation in the most demanding electronic and semiconductor environments. As a fully fluorinated linear polymer, ChipChill® RC PFPE fluid offers a rare combination of extreme thermal stability and chemical inertness, remaining liquid and effective at temperatures ranging from -100°C to over 300°C. Unlike traditional coolants that risk flammability or electrical breakdown, ChipChill® provides a non-flammable, high-dielectric strength solution (>25kV) that ensures zero residue and absolute safety. For engineers managing etching chambers, ion implanters, or high-power transformers, this PFPE heat transfer fluid is the definitive choice for maximizing uptime and protecting sensitive, high-cost components from thermal stress.

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    Advanced Molecular Engineering & Material Integrity

    The superiority of ChipChill® RC lies in its sophisticated molecular architecture. Composed strictly of Carbon, Fluorine, and Oxygen atoms, the PFPE (Perfluoropolyether) chain is inherently resistant to oxidation and thermal degradation. Our proprietary synthesis process ensures a ultra-pure, hydrogen-free composition, which is the key to its non-toxic and ozone-friendly profile.

    In terms of material compatibility, ChipChill® RC PFPE fluids are remarkably "friendly" to industrial hardware. They exhibit zero swelling or degradation when in contact with:



    1. Metals: Stainless steel, aluminum, copper, and specialized alloys.


    1. Plastics: PTFE, PFA, and high-performance engineering polymers.


    1. Elastomers: Viton, Kalrez, and common fluorinated rubbers.

     

    Strategic Application Scenarios &Technical Solutions

    ChipChill® RC is not merely a coolant; it is a critical performance enabler across several high-tech vertical markets:

    • 01

      Semiconductor Manufacturing

      Optimized for Etcher (PVD, CVD) and Ion Implanter systems where precise, repeatable temperature control is mandatory for wafer yield.

    • 02

      Electrical & Radar Systems

      Provides vital cooling for Transformers, Power Supplies, and Radar arrays, utilizing its high dielectric strength to prevent electrical arcing.

    • 03

      Pharmaceutical & Chemical Processing

      Essential for Freeze Dryers and corrosive processing environments where low-temperature fluidity and chemical resistance are required.

    • 04

      Nuclear Industry

      Its high radiation stability makes it a safe and reliable medium for UF6 production and other sensitive nuclear applications.

    Key Performance Advantages

    1. Inherent Non-Flammability: With no flash or fire point, it eliminates the risk of thermal runaway or fire in high-heat operations.
    2. Ultra-Low Dielectric Constant: Minimizes signal interference in high-frequency electronic applications.
    3. Extreme Temperature Versatility: Grades like RC130 to RC260 allow for a wider working range than almost any other fluorinated fluid on the market.
    4. Environmental Responsibility: Non-toxic, non-corrosive, and categorized as environmentally safe (non-ozone depleting).
    ChipChill RC PFPE heat transfer fluid for semiconductor wafer etching and temperature control

    Technical Specifications

    Properties

    Typical Values

    Grade

    L2-06

    L2-14

    L3-16

    L3-25

    H3-25

    H4-40

    Molecular weight (AMU)

    1,850

    2,600

    2,800

    3,450

    3,650

    4,300

    Kinematic viscosity

    (ASTM D445) @ 20℃ (cSt)

    65

    150

    163

    260

    275

    463

    Viscosity index

    (ASTM D2270)

    72

    98

    105

    110

    118

     

    Pour point (℃)

    (ASTM D97)

    -52

    -45

    -45

    -35

    -35

    -32

    Vapor Pressure

    @ 25℃ (torr)

    @ 100℃ (torr)

    7x10-7

    3x10-3

    1x10-7

    2x10-4

    2x10-6

    2x10-4

    5x10-7

    5x10-5

     

     

    Heat of vaporization

    200℃ (cal/g)

    11

    8

    8

    7

    7

    7

    Density (ASTM D891)

    20℃ (g/cm3)

    1.88

    1.89

    1.90

    1.91

    1.91

    1.91

    Surface Tension

    (dyne/cm)

    21

    22

    22

    22

    20

    20

    Evaporation loss

    22hrs @ 149℃ (% by wt)

    * 22hrs @ 120℃

    4*

    4

    3.5

    0.8

    0.5

     

    Ultimate total pressure

    (torr)

    1.7x10-3

    1.4x10-3

    2.4x10-3

    1.2x10-3

     

     

    Specific oil consumption

    (cm3/hr)

    0.4

    0.6

    0.5

    0.7

     

    Basic properties of all ChipChill® PFPE Fluids

    Properties

    Units

    Values

    Specific Heat @25℃

    Cal/(g℃)

    0.23

    Thermal Conductivity @25℃

    W/m.℃

    0.07

    Dielectric Strength @25℃

    kV (2.54mm gap)

    >25

    Dielectric Loss tanδ @25℃

     

    <0.1

    Solubility of Water

    ppm (wt)

    15

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