High-performance PFPE Coolants, MQ Resins, and Green Surfactants for the high-tech era.




Silicone Pressure Sensitive Adhesives (Silicone PSA) are a class of high-performance adhesives formulated from silicone polymers and MQ silicone resins. Unlike conventional acrylic or rubber-based PSAs, silicone PSAs offer an unmatched combination of thermal stability, chemical inertness, electrical insulation, and long-term reliability — properties that are absolutely critical in modern data center environments.
As data centers push toward higher rack densities, AI workloads, and immersion cooling architectures, the demand for adhesive materials that can withstand continuous thermal cycling, dielectric fluid exposure, and extreme temperatures has never been greater. Silicone PSA is rapidly emerging as the adhesive of choice for thermal interface bonding, component fixation, and sealing in immersion-cooled server environments.
LEARN MORE ABOUT MQ RESIN →The explosive growth of AI computing, 5G infrastructure, and hyperscale cloud services is fundamentally reshaping how data centers are designed — and the materials that power them.
Traditional air-cooled data centers are reaching their thermal limits. With GPU clusters for AI training generating heat densities exceeding 100kW per rack, liquid cooling — and specifically immersion cooling — has transitioned from a niche technology to a mainstream necessity. In single-phase and two-phase immersion cooling systems, servers are submerged directly in dielectric fluids. This demands that every adhesive, sealant, and bonding material used within the system be fully compatible with prolonged fluid exposure.
Silicone Pressure Sensitive Adhesives play a pivotal enabling role in this transition. From bonding thermal interface pads to server boards, securing gaskets in liquid-cooled modules, to adhering protective films on PCBs submerged in dielectric fluids — silicone PSA is the invisible but indispensable connector in next-generation thermal management architecture. Its resistance to PFPE and other fluorinated coolants makes it uniquely suited for immersion environments where conventional adhesives would swell, delaminate, or lose adhesion within weeks.
Major hyperscale cloud providers including Microsoft, Google, and Alibaba Cloud have publicly committed to immersion cooling deployments. OCP (Open Compute Project) has released immersion cooling specifications that explicitly require materials — including adhesives — to meet stringent chemical compatibility and thermal performance standards. This regulatory and commercial momentum is driving rapid adoption of silicone PSA across the data center supply chain, from ODM server manufacturers to thermal solution integrators.
Beyond surface-level bonding, silicone PSA enables critical structural and functional roles throughout the data center thermal ecosystem.
Silicone PSA is used to laminate and bond graphite sheets, phase-change materials, and thermal pads directly onto CPU/GPU heat spreaders. In immersion cooling, these bonds must survive continuous exposure to dielectric fluids at elevated temperatures (60–80°C) without adhesion loss, making silicone PSA the only viable long-term solution.
In immersion tanks, fluid circulation creates micro-vibrations that can fatigue solder joints over time. Silicone PSA tapes applied under large capacitors, inductors, and heatsinks provide vibration damping and mechanical reinforcement, extending MTBF (Mean Time Between Failures) of critical server components by up to 30%.
Cold plate assemblies, manifold connectors, and quick-disconnect fittings in liquid cooling loops require reliable sealing. Silicone PSA-backed gaskets offer conformable, pressure-activated sealing without the need for mechanical fasteners, simplifying assembly and enabling tool-free maintenance in high-density rack environments.
Edge data centers and UPS battery banks require precise thermal management to prevent thermal runaway. Silicone PSA is applied between battery cells and aluminum cooling plates, providing both thermal conductivity enhancement and electrical isolation — a dual function impossible with conventional adhesives.
Power distribution cables in high-density racks operate at elevated temperatures. Silicone PSA tapes rated to 200°C+ are used for cable bundling, routing, and insulation in areas near high-heat components, replacing traditional PVC tapes that would soften or off-gas at these temperatures.
One of the most demanding requirements for PSA in immersion cooling is compatibility with PFPE, HFE, and mineral oil-based dielectric fluids. Silicone PSA formulated with MQ resin hybrid structures demonstrates less than 2% weight gain after 1000 hours of immersion in PFPE fluids — a critical specification for system reliability and warranty compliance.
Silicone PSA is increasingly used for structural bonding of aluminum extrusions, sheet metal panels, and composite materials in server chassis and rack enclosures. Its ability to bond dissimilar materials without stress concentration makes it superior to mechanical fasteners in vibration-prone environments.
As data centers adopt co-packaged optics (CPO) and silicon photonics for AI interconnects, thermal management of optical transceivers becomes critical. Silicone PSA provides low-stress, optically clear bonding for photonic components where mechanical stress would alter refractive indices and degrade signal integrity.
From Semiconductor manufacturing to Automotive sealing, exploring our versatile applications.
We are the first Chinese manufacturer to produce Y-Type FSA on a large scale and a leading producer of immersion coolants, directly contributing to carbon neutrality.
Our innovation is driven by Kingrande's unique APA&D (Advanced Polymer Architecture and Design) Platform, which integrates Advanced Polymer Hybridization (APH), Polymerization Process (APP), Modification Process (AMP), and Functionalization (APF). This platform enables us to engineer silicone PSA formulations with precisely tuned tack, peel, and thermal resistance profiles for immersion cooling applications.
Supported by advanced equipment such as short-path molecular distillation and electronic-grade purification filtration, we ensure superior product quality. Our manufacturing lines are capable of producing silicone PSA with consistent molecular weight distribution and minimal ionic contamination — essential for semiconductor and data center applications.
Our R&D team consists of 30 professionals. To date, we have secured 49 patents (including 27 national invention patents and 19 utility model patents) accepted by the State Intellectual Property Office. Our ChipChill coolant helps IDC centers achieve a PUE value close to 1.0, while our silicone PSA solutions are qualified for use in immersion cooling environments globally.

Building on the legacy of CGFSE (FSE) & Aifluo, supplying premium FKM Elastomers and PPA Additives. Our silicone PSA and immersion cooling material portfolio extends this trusted industrial heritage into the data center era.
State-of-the-art analytical instruments ensure every silicone PSA batch meets the exacting standards required for data center and immersion cooling applications.

Utilizing Fourier Transform Infrared Spectroscopy to identify molecular structures and ensure chemical purity at a microscopic level.

Precise purity testing and volatile compound analysis to guarantee silicone PSA performance in sealed electronic environments.

High-performance liquid chromatography for detailed chemical mixture analysis and quality verification of silicone resin formulations.

Dispersion testing and particle size distribution analysis for emulsion-type silicone PSA and coolant formulations.

Thermal stability profiling to validate silicone PSA performance under continuous high-temperature data center operating conditions.

Gel Permeation Chromatography for precise molecular weight distribution analysis of silicone polymers and MQ resin hybrids.
Explore our comprehensive range of silicone-based materials engineered for data center immersion cooling, thermal interface management, and advanced electronic assembly.

High-tack silicone PSA formulated for continuous PFPE and HFE dielectric fluid immersion. Maintains >95% adhesion after 1000h immersion at 80°C.
VIEW DETAILS →
Advanced branched cage-like oligosiloxane MQ resin hybrid PSA for cold plate sealing and liquid-cooled module gasketing applications.
VIEW DETAILS →
200°C-rated silicone PSA tape for cable bundling, harness routing, and insulation near high-heat GPU and power delivery components.
VIEW DETAILS →
Dielectric silicone PSA for securing capacitors, inductors, and heatsinks on PCBs submerged in dielectric cooling fluids.
VIEW DETAILS →
Filled silicone PSA with enhanced thermal conductivity (≥1.5 W/m·K) for direct GPU/CPU heatsink lamination in AI server platforms.
VIEW DETAILS →
Dual-function silicone PSA providing thermal conductivity and electrical isolation between Li-ion cells and aluminum cooling plates in UPS systems.
VIEW DETAILS →Ultra-low ionic contamination silicone PSA for wafer mounting, dicing tape, and back-grinding applications in semiconductor manufacturing.
VIEW DETAILS →
MIL-spec silicone PSA for thermal management and vibration damping in avionics, satellite, and high-reliability aerospace electronic assemblies.
VIEW DETAILS →